Settling of inclusions in top-cut solar grade silicon (SOG-SI) under electromagnetic field
dc.contributor.author | Damoah, L.N.W. | |
dc.contributor.author | Zhang, L. | |
dc.date.accessioned | 2013-01-03T07:56:28Z | |
dc.date.accessioned | 2017-10-14T06:40:30Z | |
dc.date.available | 2013-01-03T07:56:28Z | |
dc.date.available | 2017-10-14T06:40:30Z | |
dc.date.issued | 2012 | |
dc.description.abstract | Increasing demand for Solar Grade Silicon (SoG-Si) due to rising interest in renewable energy has lead to increased SoG-Si Top - cut scraps generated from the multi-crystalline silicon making process. Due to the high cost of SoG-Si and the potential to use the top-cut scraps as feedstock material, there has been increased effort to develop cost effective and efficient technologies. As a result, several methods to recycle the top-cut scraps are currently been applied, and researched. These include settling under gravitation field, which is a slow process to be industrially applicable. Natural settling of inclusions by gravitational force is a slow process and not attractive to the industry. Recent experiments on Top-cut SoG-Si scrap under high frequency, high voltage, electromagnetic field showed that SiC inclusions settled within a short time to the bottom of the crucible and the characteristic rod-like morphologies of Si 3N 4 inclusions in SoG-Si were not detected. This study investigates the enhanced settling of SiC inclusions and the behavior of Si 3N 4 particles under the influence of high frequency, high voltage, electromagnetic field in Top-cut SoG-Si. | en_US |
dc.identifier.citation | Damoah, L. N. W. and Zhang, L. (2012) Settling of Inclusions in Top-cut Solar Grade Silicon SOG-Si Scraps under Electromagnetic Field, in 3rd International Symposium on High-Temperature Metallurgical Processing (eds T. Jiang, J.-Y. Hwang, P. Masset, O. Yucel, R. Padilla and G. Zhou), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9781118364987.ch34 | en_US |
dc.identifier.uri | http://197.255.68.203/handle/123456789/2299 | |
dc.language.iso | en | en_US |
dc.publisher | John Wiley & Sons, Inc. | en_US |
dc.subject | Electromagnetic | en_US |
dc.subject | Inclusions | en_US |
dc.subject | Settling | en_US |
dc.subject | Silicon | en_US |
dc.title | Settling of inclusions in top-cut solar grade silicon (SOG-SI) under electromagnetic field | en_US |
dc.type | Article | en_US |