Removal of inclusions from solar grade silicon using electromagnetic field

dc.contributor.authorDong, A.
dc.contributor.authorDamoah, L.N.W.
dc.contributor.authorZhu, H.
dc.contributor.authorZhang, L.
dc.contributor.authorWang, C.
dc.date.accessioned2013-01-03T08:03:41Z
dc.date.accessioned2017-10-14T06:40:31Z
dc.date.available2013-01-03T08:03:41Z
dc.date.available2017-10-14T06:40:31Z
dc.date.issued2011
dc.description.abstractThe characteristics of the top-cut solar grade silicon (SoG-Si) scraps produced from SoG-Si ingots were investigated using optical microscope observation, SEM-EDS analysis and automatic inclusion scanning (ASPEX). Particles of SiC and Si3N4 are the main non-metallic inclusions in the SoG silicon top-cut scrap. The deeper into the scrap from the surface, the less and smaller inclusions are found. A laboratory-scale electromagnetic purification unit was used to melt the silicon scraps and remove inclusions from the melt. The experimental results indicated that the electromagnetic (EM) field efficiently pushed the non-metallic particles and less-conductive metallic impurity elements to the boundary layer.en_US
dc.identifier.citationThe Minerals, Metals & Materials Society (TMS) (2011) Removal of Inclusions from Solar Grade Silicon Using Electromagnetic Field, in Supplemental Proceedings: Materials Processing and Energy Materials, Volume 1, John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9781118062111.ch77en_US
dc.identifier.urihttp://197.255.68.203/handle/123456789/2302
dc.language.isoenen_US
dc.publisherJohn Wiley & Sons, Inc.en_US
dc.subjectElectromagnetic fielden_US
dc.subjectInclusionsen_US
dc.subjectSolar cell siliconen_US
dc.titleRemoval of inclusions from solar grade silicon using electromagnetic fielden_US
dc.typeArticleen_US

Files

License bundle

Now showing 1 - 2 of 2
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.82 KB
Format:
Item-specific license agreed upon to submission
Description:
Loading...
Thumbnail Image
Name:
license.txt
Size:
0 B
Format:
Item-specific license agreed upon to submission
Description: